http://www.rssboard.org/rss-specification 720 https://escholarship.org/uc/nanocad_rw/rss Recent eScholarship items from Technical Reports Fri, 15 May 2026 14:27:10 +0000 https://escholarship.org/uc/item/0gt7j9qj Software-Defined ECC: Heuristic Recovery from Uncorrectable Memory Errors https://escholarship.org/uc/item/0gt7j9qj Thu, 30 Nov 2017 00:00:00 +0000 Gottscho, Mark Schoeny, Clayton Dolecek, Lara Gupta, Puneet https://escholarship.org/uc/item/4m7366mk With increase in transistor packing density and use ofuni-directional metal routing, resources on local metal layers areincreasingly limited. A major contributor to routing congestion is theminimum metal area (minArea) design rule, which has been steadilyincreasing over the past few technology nodes. For a net which crossesmultiple metal layers (e.g., M2 to M4), polygons on intermediate layers(e.g., M3) i.e. via landing pads must satisfy the minArea rule; thiscreates unnecessary routing blockage, which can lead to area overhead.In this work, we investigated the benefits of introduction into theBEOL stack of a new “supervia” structure, namely, a double-height viaspanning two metal layers without a landing pad on an intermediatemetal layer. We study the benefit of supervia using (i) routing clip-basedevaluation using an optimal ILP-based router (OptRouterSV) and (ii)chip-level evaluation using a commercial routing tool in conjunctionwith MILP-based supervia aware legalization. With... https://escholarship.org/uc/item/4m7366mk Mon, 3 Jul 2017 00:00:00 +0000 Pal, Saptadeep https://escholarship.org/uc/item/5rn3p93d ViPZonE: Exploiting DRAM Power Variability for Energy Savings in Linux x86-64 https://escholarship.org/uc/item/5rn3p93d Wed, 8 Oct 2014 00:00:00 +0000 Gottscho, Mark https://escholarship.org/uc/item/3967v8hw A Case Study of Logic Delay Fault Behaviors on General-Purpose Embedded Processor Under Voltage Overscaling https://escholarship.org/uc/item/3967v8hw Thu, 7 Aug 2014 00:00:00 +0000 Lai, Liangzhen Gupta, Puneet https://escholarship.org/uc/item/5898p020 Exploring Total Power Saving from High Temperature of Server Operations https://escholarship.org/uc/item/5898p020 Mon, 2 Jun 2014 00:00:00 +0000 Lai, Liangzhen Chang, Chia-Hao Gupta, Puneet https://escholarship.org/uc/item/1c21g217 RedCooper: Hardware Sensor Enabled Variability Software Testbed for Lifetime Energy Constrained Application https://escholarship.org/uc/item/1c21g217 Mon, 2 Jun 2014 00:00:00 +0000 Agarwal, Yuvraj Bishop, Alex Chan, Tuck-Boon Fotjik, Matt Gupta, Puneet Kahng, Andrew Lai, Liangzhen Martin, Paul Srivastava, Mani Sylvester, Dennis Wanner, Lucas Zhang, Bing